Wire bonder TPT HB 16 (WIRE-BONDER)

Profile card (PDF)

Technologies for ensuring the dies to be properly interconnected and packaged with high precision, accuracy and reliability to eliminate damage of dies and enable easily manipulation. Supporting inspection technologies should provide the possibility of optical surface monitoring and inspection of interconnection and soldering process. Electrical characterization probe station is also planned, as well as temperature dependencies and working stress testing of fabricated dies.

Publications:

• TAKHSHA GHAHFAROKHI, M.; HORKÝ, M.; NASI, L.; KOSOGOR, A.; TREVISI, G.; CASOLI, F.; ARREGI URIBEETXEBARRIA, J.; BRESCIA, R.; UHLÍŘ, V.; ALBERTINI, F., 2025: Spatially confined magnetic shape-memory Heuslers: Implications for nanoscale devices. ACTA MATERIALIA 284, p. 1 - 11, doi: 10.1016/j.actamat.2024.120579; FULL TEXT
  (VERIOS, MIRA-EBL, RIE-FLUORINE, VERSALAB, WIRE-BONDER)
• Horký, M., 2025: . PH.D. THESIS , p. 1 - 181; FULL TEXT
  (RAITH, MIRA-EBL, LYRA, TEGRAMIN, SUSS-MA8, DEKTAK, NANOCALC, MAGNETRON, EVAPORATOR, RIE-FLUORINE, WIRE-BONDER, MPS150, CRYOGENIC, LAKESHORE, VERSALAB, ICON-SPM, UHV-PREPARATION, TITAN, HELIOS, VERIOS, RIGAKU3, RIGAKU9)
• SUPALOVÁ, L.; BARTOŠÍK, M.; ŠVARC, V.; MACH, J.; PIASTEK, J.; ŠPAČEK, O.; KONEČNÝ, M.; ŠIKOLA, T., 2025: High-Temperature Ultrasensitive FET-Based CVD Graphene Hall Probes. ACS APPLIED ELECTRONIC MATERIALS 7(13), p. 5889 - 5897, doi: 10.1021/acsaelm.5c00351; FULL TEXT
  (DWL, SUSS-MA8, EVAPORATOR, MIRA-EBL, RIE-FLUORINE, WIRE-BONDER, WITEC-RAMAN, LYRA)
• Děcký, M., 2025: . MASTER'S THESIS , p. 1 - 63; FULL TEXT
  (MIRA-EBL, SUSS-MA8, DEKTAK, NANOCALC, MAGNETRON, RIE-FLUORINE, EVAPORATOR, WIRE-BONDER, MPS150, LYRA, LASER-DICER)
• Kunc, J.; Fridrišek, T.; Shestopalov, M.; Jo, J.; Park, K., 2024: . AIP ADVANCES 14(9), p. 1 - 9, doi: 10.1063/5.0223763; FULL TEXT
  (RAITH, RIE-FLUORINE, ALD-FIJI, EVAPORATOR, WIRE-BONDER, KRATOS-XPS)

• Otýpka, M., 2024: . BACHELOR'S THESIS , p. 1 - 56; FULL TEXT
  (MAGNETRON, VERSALAB, DWL, WIRE-BONDER, KERR-MICROSCOPE)
• JAKEŠOVÁ, M.; KUNOVSKÝ, O.; GABLECH, I.; KHODAGHOLY, D.; GELINAS, J.; GLOWACKI, E., 2024: . JOURNAL OF NEURAL ENGINEERING 21(4), doi: 10.1088/1741-2552/ad593d; FULL TEXT
  (PARYLENE-SCS, MAGNETRON, SUSS-MA8, EVAPORATOR, RIE-FLUORINE, DIENER, WIRE-BONDER)
• KOVAŘÍK, M.; CITTERBERG, D.; PAIVA DE ARAÚJO, E.; ŠIKOLA, T.; KOLÍBAL, M., 2024: . ACS APPLIED ELECTRONIC MATERIALS 6(12), p. 8776 - 7, doi: 10.1021/acsaelm.4c01450; FULL TEXT
  (ALD-FIJI, MIRA-EBL, EVAPORATOR, MPS150, KEITHLEY-4200, LYRA, LITESCOPE-LYRA, WITEC-RAMAN, WIRE-BONDER, NANOSCAN)
• HRUBÝ, J.; LAGUTA, O.; SOJKA, A.; ST. MARIE, L.; MYERS-WARD, R.; GASKILL, K.; EL FATIMY, A.; BARBARA, P.; NEUGEBAUER, P., 2024: . APPLIED PHYSICS LETTERS 124(12), p. 1 - 6, doi: 10.1063/5.0191087; FULL TEXT
  (WIRE-BONDER)
• Koňařík, L., 2024: . BACHELOR'S THESIS , p. 1 - 46; FULL TEXT
  (LASER-DICER, DWL, EVAPORATOR, RIE-FLUORINE, DRIE, NANOCALC, DEKTAK, WIRE-BONDER, LYRA)
• Hnilica, J., 2023: . MASTER'S THESIS ; FULL TEXT
  (MAGNETRON, VERSALAB, RIGAKU9, SUSS-RCD8, DWL, WIRE-BONDER, KERR-MICROSCOPE)
• ŠVARC, V.; BARTOŠÍK, M.; KONEČNÝ, M.; PIASTEK, J.; NEZVAL, D.; MACH, J.; ŠIKOLA, T., 2023: . CARBON 215, p. 118471 - 12, doi: 10.1016/j.carbon.2023.118471; FULL TEXT
  (RIE-FLUORINE, EVAPORATOR, MIRA-EBL, WIRE-BONDER)
• Mahel, V., 2023: . MASTER'S THESIS ; FULL TEXT
  (DWL, DRIE, DEKTAK, DIENER, WIRE-BONDER)
• GABLECH, I.; BRODSKÝ, J.; VYROUBAL, P.; PIASTEK, J.; BARTOŠÍK, M.; PEKÁREK, J., 2022: . JOURNAL OF MATERIALS SCIENCE 57(3), p. 1923 - 13, doi: 10.1007/s10853-021-06846-6; FULL TEXT
  (RIE-FLUORINE, DRIE, EVAPORATOR, WIRE-BONDER, WITEC-RAMAN, MPS150, KEITHLEY-4200, SUSS-MA8, DWL)
• Fridrišek, T., 2022: . MASTER'S THESIS
  (MIRA-EBL, RIE-FLUORINE, EVAPORATOR, WIRE-BONDER, LYRA)
• Vaňatka, M., 2021: . PH.D. THESIS , p. 1 - 113; FULL TEXT
  (VERSALAB, VNA-MPI, TITAN, BRILLOUIN, MIRA-EBL, RAITH, KERR-MICROSCOPE, MAGNETRON, EVAPORATOR, VERIOS, WIRE-BONDER, LYRA)
• GHAHFAROKHI, M.; ARREGI URIBEETXEBARRIA, J.; CASOLI, F.; HORKÝ, M.; CABASSI, R.; UHLÍŘ, V.; ALBERTINI, F., 2021: . APPLIED MATERIALS TODAY 23, p. 101058-1 - 11, doi: 10.1016/j.apmt.2021.101058; FULL TEXT
  (VERSALAB, RIGAKU9, KERR-MICROSCOPE, SUSS-MA8, RIE-FLUORINE, EVAPORATOR, WIRE-BONDER, VERIOS)
• Dhankhar, M.;, 2021: . PH.D. THESIS , p. 1 - 100; FULL TEXT
  (KERR-MICROSCOPE, DWL, MIRA-EBL, RAITH, KAUFMAN, EVAPORATOR, MAGNETRON, ALD-FIJI, WIRE-BONDER, SUSS-RCD8, ICON-SPM)
• Chmela, O., 2020: . PH.D THESIS , p. 1 - 199
  (ALD-FIJI, DWL, KAUFMAN, DIENER, SUSS-MA8, SUSS-RCD8, RAITH, MAGNETRON, EVAPORATOR, RIE-FLUORINE, SCIA, DEKTAK, NANOCALC, MPS150, WIRE-BONDER, ICON-SPM)
• Hache, T.; Vanatka, M.; Flajsman, L.; Weinhold, T.; Hula, T.; Ciubotariu, O.; Albrecht, M.; Arkook, B.; Barsukov, I.; Fallarino, L.; Hellwig, O.; Fassbender, J.; Urbanek, M.; Schultheiss, H., 2020: . PHYSICAL REVIEW APPLIED 13(5), p. 054009-1 - 10, doi: 10.1103/PhysRevApplied.13.054009; FULL TEXT
  (RAITH, RIE-FLUORINE, EVAPORATOR, WIRE-BONDER, BRILLOUIN)
• Tesař, J., 2020: . MASTER'S THESIS , p. 1 - 67
  (WITEC-RAMAN, MPS150, UHV-LEEM, EVAPORATOR, RAITH, WIRE-BONDER, ICON-SPM)
• GABLECH, I.; KLEMPA, J.; PEKÁREK, J.; VYROUBAL, P.; HRABINA, J.; HOLÁ, M.; KUNZ, J.; BRODSKÝ, J.; NEUŽIL, P., 2020: . MICROMACHINES 11(2), p. 1 - 10, doi: 10.3390/mi11020143; FULL TEXT
  (DRIE, RIE-CHLORINE, WIRE-BONDER, KAUFMAN)
• Hegrová, V., 2019: . MASTER'S THESIS , p. 1 - 64
  (LITESCOPE-LYRA, MIRA-EBL, RIE-FLUORINE, EVAPORATOR, WIRE-BONDER, LYRA)
• Citterberg, D., 2019: . MASTER'S THESIS , p. 1 - 50
  (MIRA-EBL, EVAPORATOR, WITEC-RAMAN, WIRE-BONDER, TITAN, MPS150)
• Procházka, P., 2018: . PH.D. THESIS , p. 1 - 139
  (ALD-FIJI, DIENER, EVAPORATOR, MIRA-EBL, PECVD, WIRE-BONDER)
• CHMELA, O.; SADÍLEK, J.; SAMA, DOMENECH-GIL, G.; J.; SOMER, J.; MOHAN, R.; ROMANO-RODRIGUEZ, A.; HUBÁLEK, J.; VALLEJOS VARGAS, S., 2018: . NANOSCALE 10(19), p. 9087 - 10, doi: 10.1039/c8nr01588k; FULL TEXT
  (RAITH, DWL, KAUFMAN, MAGNETRON, SCIA, RIE-FLUORINE, WIRE-BONDER, RIGAKU3)
• SVATOŠ, V.; GABLECH, I.; PEKÁREK, J.; KLEMPA, J.; NEUŽIL, P., 2018: . INFRARED PHYSICS & TECHNOLOGY 93, p. 286 - 5, doi: 10.1016/j.infrared.2018.07.037; FULL TEXT
  (WIRE-BONDER)
• Křižáková, V., 2018: . MASTER'S THESIS , p. 1 - 83
  (HELIOS, MIRA-EBL, EVAPORATOR, WIRE-BONDER, KERR-MICROSCOPE, LYRA, ICON-SPM)
• PROCHÁZKA, P.; MAREČEK, D.; LIŠKOVÁ, Z.; ČECHAL, J.; ŠIKOLA, T., 2017: . SCIENTIFIC REPORTS 7, p. 1 - 7, doi: 10.1038/s41598-017-00673-z; FULL TEXT
  (MIRA-EBL, DIENER, ALD-FIJI, WIRE-BONDER)
• MACH, J.; PROCHÁZKA, P.; BARTOŠÍK, M.; NEZVAL, D.; PIASTEK, J.; HULVA, J.; ŠVARC, V.; KONEČNÝ, M.; KORMOŠ, L.; ŠIKOLA, T., 2017: . NANOTECHNOLOGY 28(41), p. 1 - 10, doi: 10.1088/1361-6528/aa86a4; FULL TEXT
  (DIENER, DWL, EVAPORATOR, WIRE-BONDER, LYRA)
• HRDÝ, R.; KYNCLOVÁ, H.; KLEPÁČOVÁ, I.; BARTOŠÍK, M.; NEUŽIL, P., 2017: . ANALYTICAL CHEMISTRY 89(17), p. 8731 - 7, doi: 10.1021/acs.analchem.7b00776; FULL TEXT
  (MPS150, WIRE-BONDER)
• VAŇATKA, M.; URBÁNEK, M.; JÍRA, R.; FLAJŠMAN, L.; DHANKHAR, M.; IM, M.; MICHALIČKA, J.; UHLÍŘ, V.; ŠIKOLA, T., 2017: . AIP ADVANCES 7(10), p. 1 - 8, doi: 10.1063/1.5006235; FULL TEXT
  (DWL, EVAPORATOR, RAITH, TITAN, WIRE-BONDER)
• Turčan, I., 2017: . MASTER'S THESIS , p. 1 - 55
  (MIRA-EBL, EVAPORATOR, MAGNETRON, WIRE-BONDER)
• Holobrádek, J., 2017: . BACHELOR'S THESIS , p. 1 - 48
  (TITAN, MIRA-EBL, EVAPORATOR, WIRE-BONDER, CRYOGENIC, ICON-SPM)
• Citterberg, D., 2017: . BACHELOR'S THESIS , p. 1 - 26
  (DWL, MIRA-EBL, WIRE-BONDER, EVAPORATOR)
• Vaňatka, M., 2017: . TREATISE TO STATE DOCTORAL EXAM , p. 1 - 31
  (TITAN, MIRA-EBL, EVAPORATOR, MAGNETRON, WIRE-BONDER, LYRA)
• Lišková, Z., 2015: . PH.D. THESIS , p. 1 - 106
  (MIRA-EBL, DIENER, NANOCALC, DWL, EVAPORATOR, WIRE-BONDER, ALD-FIJI, LYRA)
• Švarc, V., 2015: . MASTER'S THESIS , p. 1 - 50
  (ALD-FIJI, DIENER, WIRE-BONDER, LYRA)
• Kormoš, L., 2015: . MASTER'S THESIS , p. 1 - 59
  (DIENER, WIRE-BONDER, LYRA)
• URBÁNEK, M.; UHLÍŘ, V.; LAMBERT, C.; KAN, J.; EIBAGI, N.; VAŇATKA, M.; FLAJŠMAN, L.; KALOUSEK, R.; IM, M.; FISCHER, P.; ŠIKOLA, T.; FULLERTON, E., 2015: . PHYSICAL REVIEW B 91(9), p. 094415-1 - 11, doi: 10.1103/PhysRevB.91.094415; FULL TEXT
  (MIRA-EBL, WIRE-BONDER, LYRA)