Resist coating and development system SÜSS MicroTec RCD8 (SUSS-RCD8)


Guarantor:
Radim Hrdý, Ph.D.

Instrument status:
Operational Operational, 22.1.2024 12:45, The EBR valve has been repaired. Please, test the EBR function and give us feedback. Thank you.

Equipment placement:
CEITEC Nano - C1.30


Resist mask preparation for fabrication of nano and microstructures with ultimate dimensions below 50 nm. Includes resist spin coating facility, complete photolithography setup and electron beam lithography / shared by CEITEC users, open facilities


Publications:

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Photogallery

Specification

General

Substrate size 2” to 200 mm round, 2” to 150 mm square
Substrate Handling manual, lift pins
User Interface SUSS MMC Tool Control on Win 7, industrial PC, touch screen
Max. # of Recipes more than 10 000
Max. # of Process Steps 50


Module: Open Bowl Coater

Spin Speed Max 10 000 RPM
Spin Acceleration 1 – 7000 RPM/s
Bowl Material Ni-plated Al
Dispense arm 1 resist line, 1 solvent line, motorized syringe pump

Module: Gyrset Coater

Spin Speed Max 3 000 RPM
Spin Acceleration 1 – 3000 RPM/s
Bowl Material Ni-plated Al
Cover Options 3 different sizes in low and high versions

Module: Puddle developer

Spin Speed Max 10 000 RPM
Spin Acceleration 1 – 7000 RPM/s
Bowl Material PE
Cover Options 1 developer line

Documents

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