UV Direct Write Laser system Heidelberg Instruments DWL 66-fs (DWL)


Guarantor:
Peter Fecko

Instrument status:
Operational Operational, 17.10.2025 14:15

Equipment placement:
CEITEC Nano - C1.29

Upcoming trainings:
17.11. 11:00 - 14:00: DWL basics - Meeting in front of user office.


Resist mask preparation for fabrication of nano and microstructures with ultimate dimensions below 50 nm. Includes resist spin coating facility, complete photolithography setup and electron beam lithography / shared by CEITEC users, open facilities


Publications:

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Photogallery

Specification

DWL 66FS key features

Substratesfrom 10 mm x 10 mm up to 200 mm x 200 mm
Structures resolutiondown to 1 µm
Address griddown to 100 nm
Exposure modeRaster
Special – 3D
Layout alignmentCamera system
ChamberClimate
AutofocusAir-gauge, Laser
Scripting capability
Data inputs format2DXF, CIF, GDS, Gerber, BMP, Ascii, STL

Advanced

Multiple write modes

Write mode2
Address Grid [nm]100
Minimum Structure Size [µm]1
Write speed [mm2/min]10
Edge Roughness [3sigma, nm]80
CD Uniformity [3sigma, nm]100
Alignment Accuracy [3sigma, nm]250


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