Scanning electron microscope (SEM) MIRA3 XMU (MIRA-STAN)


Scanning electron microscope (SEM) MIRA3 XMU

Guarantor:
Petr Lepcio, Ph.D.

Instrument status:
Some Issues Some Issues, 14.4.2025 11:10, RBSE detector movement issue - sometimes gets stuck when retracting to parking position. Pull out the detector manually by turning the turnwheel on the backside of the detector, if necessary. Service request sent to Tescan, repair date unknown.

Equipment placement:
CEITEC Nano - A1.11

Upcoming trainings:
11.6. 09:00 - 15:30: MIRA-STAN 1/2 - Meeting point at the microscope. This is a two-step training, register for part 2 in our booking system. Obligatory prerequisites must be completed 2 days before the training. More information about the training is available on our <a href=”https://cfmoodle.ceitec.vutbr.cz/course/view.php?id=76”>Moodle</a>.
17.6. 09:00 - 12:00: MIRA-STAN 2/2 - Meeting point at the microscope. This is a two-step training, register for part 1 in our booking system. More information about the training is available on our <a href=”https://cfmoodle.ceitec.vutbr.cz/course/view.php?id=76”>Moodle</a>.
19.6. 09:00 - 12:00: MIRA-STAN 2/2 - Meeting point at the microscope. This is a two-step training, register for part 1 in our booking system. More information about the training is available on our <a href=”https://cfmoodle.ceitec.vutbr.cz/course/view.php?id=76”>Moodle</a>.


Scanning electron microscope (SEM) MIRA3 XMU

Description

• Scanning electron microscope (SEM) is used to study the morphology and topography of conductive and non-conductive materials in high resolution (micro to nano-scale).
• Observation of surface samples with high depth of focus using multiple detection system (SE, BSE, STEM) including elemental analysis using energy dispersive spectrometer (EDS).

Applications

• Observation of both the surface and internal structure of micro and nano-objects (phase interface such as matrix-filler/reinforcement, particle distribution, aggregates and defects, fracture surfaces, porous 3D materials, units of supramolecular structure, etc.)
• evaluation of the shape and dimensions (length, diameter, volume, roughness) of powders, tubes, short fibers
• fast and highly accurate chemical microanalysis and elemental mapping of a sample surface
• qualitative elemental analysis including determination of the distribution of each element
• quantitative analysis of the individual elements in a sample
• The structural analysis of polymeric materials, biopolymers and composites, biomaterials, ceramics, bones, teeth, substrates for tissue engineering, etc.

Specification

• High Brightness Schottky Emitter
• Detectors:
SE, BSE, In-beam SE, In-Beam BSE
LVSTD
STEM detector
EDX analysis
• High-vacuum (≤9x10-3Pa) or low-vacuum mode (7-500 Pa)
• Magnification 25 to 1 000 000x
• Acceleration voltage 200 V to 30 kV
• X-Y-Z 130×130×100mm
• Maximum specimen height: 106 mm


Publications:

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Specification


Type
MIRA3
ManufacturerTESCAN
Type of microscopeSEM
Electron beam sourceSchottky FEG cathode
Acceleration voltage200 eV – 30 kV
50 eV – 30 kV for Beam Deceleration Mode
Electron beam current2 pA – 200 nA
Magnificationmax 1 000 000 x
View Field6,4 mm at WD 10 mm
DetectorsSE
Low energy BSE
In-Beam SE
In-Beam BSE
STEM (transmission mode) s BF, DF
LVSTD (detector SE v Low-vacuum mode)

Resolution in High-vacuum mode

SE

In-Beam SE
Beam Deceration Mode

STEM

1.2 nm at 30 kV
2.5 nm at 3.0 kV
1.0 nm at 30 kV
1.5 nm at 3.0 kV
2.5 nm at 200 V
0.8 nm at 30 kV
Resolution in Low-vacuum modeBSE
LVSTD
2.0 nm at 30 kV
1.5 nm at 30 kV

Detector EDX
(for elemental analysis)

X-max20
Surface of SDD chipset 20 mm2
<127eV @ Mn Kα
Oxford Instruments
Observation modesResolution, Depth, Field, Wide field, Channeling

Additional imaging modes
(suitable for non-conductive samples)

Beam Deceleration Mode (BDM)
Low vacuum mode

StageStandard TESCAN stage
X, Y = 130 mm (od -65 do +65 mm)
Z = 100 mm
Tilt from -30° to +90°
Rotation 360°
+TESCAN STEM sample holder (8 samples – standard TEM grids)
Peltier stageDiameter of the specimen holder:12.5 mm
Temperature range: -50 °C to +70 °C
(High Vacuum Mode)
Cooling speed:30 °C/min
Temperature accuracy:±1.2 °C
Temperature stability:±0.2 °C
ChamberChamber XM
Width 290 mm x Depth 340 mm
IR navigation camera
VacuumHigh-vacuum mode <9·10-3 Pa
Low-vacuum mode 7–500 Pa
Electron gun pressure <3·10-7 Pa



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