Nanofabrication laboratory equipment


  Nanolithography

E-beam writer RAITH150 Two (RAITH)

Raith 150 Two is high resolution low voltage electron lithography (EBL) and metrology system. It is suitable for research and development of MEMS, micro and nanoelectronic, plasmonic, photonic systems and integrated optical devices.

Scanning Electron Microscope/E-beam writer TESCAN MIRA3/RAITH LIS (MIRA)

Scanning electron microscope equipped with laser intereferometry stage capable working with samples up to 50x50 mm2. Overlay and stitching accuracy below 100 nm, linewidth below 20 nm.

UV Direct Write Laser system HEIDELBERG DWL 66-fs (DWL)

The DWL 66FS laser lithography system is a high resolution pattern generator for low volume mask making and direct writing. The capabilities and flexibility of this system allows to use this research tool in MEMS, BioMEMS, Micro Optics, ASICs, Micro Fluidics, Sensors, CGHs, and all other applications that require microstructures.

Mask Aligner SÜSS MicroTec MA8 (SUSS-MA8)

Süss MicroTec MA8 is standard UV litography tool for exposing wafers through mask. Exposure can be carried out in proximity mode or in contact mode. MA8 is equipped with top side optical microscopes and bottom side microscopes, so alignment is possible from both sides of the wafer.

Coating and development system SÜSS MicroTec RCD8 (SUSS-RCD8)

The RCD8 coat and develop platform is equipped with basic manual spin coater and a GYRSET® enhanced coater and puddle developer tool. It can handle small pieces as well as standard wafers up to 200 mm and serves therefore ideally for daily R&D work up to small scale production.

Lithographic wetbench for coating (SUSS-WETBENCH)

The wetbench is a complete basic setup for substrate coating. It consists of built-in spin-coater LabSpin 6 for manual resist dispense, two hot plate modules HP8, and one vapour primer VP8 for HMDS coating (adhesion promoter).

Mechanical profilometer Bruker Dektak XT (DEKTAK)

The Dektak stylus surface profiler is an advanced thin and thick film step height measurement tool. In addition to profiling surface topography and waviness, the Dektak system measures roughness in the nanometer range.

Resist stripper Diener NANO Plasma cleaner (DIENER)

Diener NANO Plasma Cleaner with microwave generator can be used for stripping of the resist. Microwave plasma is ideal for most resist removal in modern device fabrication.

Spectroscopic reflectometer Ocean Optics NanoCalc 2000 (NANOCALC)

Multilayers characterization, resist thickness measurement mainly. Interval of measure film thickness from 10 nm up to 100 um.

Optical microscope Zeiss Axio Imager A2 (ZEISS-A2)

Microscope Zeiss Axio Imager.A2 for control of lithography processes in reflected-light, bright field and dark field. With PC interface.


 ​ Etching & Deposition

Deep reactive ion etching of Si-based materials Oxford Instruments Plasma Technology PlasmaPro 100 (DRIE)

Deep reactive-ion etching (DRIE) is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios.

Experimental PECVD

Experimental plasma enhanced CVD reactor is constructed for diagnostics of plasmachemical processes in capacitively coupled radio frequency (RF) discharges (13.56 MHz). It is possible to measure a delivered RF power, investigate presence of plasma-excited species by optical emission spectroscopy, obtain information about energy and flux of ions impinging on the substrate RF electrode, measure mass and ion energy spectra of plasma phase particles.

High temperature plasma enhanced chemical vapour deposition system on C-based materials Oxford Instruments Plasma Technology NanoFab (PECVD-NANOFAB)

Chemical vapour deposition system going to very high deposition temperatures dedicated to the deposition of carbon nanomaterials, possibilities of plasma enhancement by discharges of different frequency (including their regular switching).

Ion beam etching Scia Systems Coat 200  (SCIA SYSTEMS)

Physical vapor deposition method allows thin films to be etched by the use of broad beams of positively charged ions in a high vacuum system. The system is equipped with SIMS spectrometer for precise end-point detection.

Low pressure chemical vapor deposition (LPCVD)

Facilities and methods enabling nanolayer and single atom layer deposition, nanostructure preparation and fabrication of new devices and systems (electronic, photonic, electromechanical).

Magnetron sputtering system BESTEC  (MAGNETRON)

The system consists of a sputter deposition chamber with 8 magnetrons in sputter up configuration. The lid flange of the sputtering chamber is sealed with double viton o- rings and differentially pumped.

Rapid thermal annealing Xerion XREACT/1 250°C  (XERION)

The heating sources for the XREACT radiation furnaces are halogen lamps or short arc lamps. Heating rates up to 150 k/s are possible. In our Rapid Thermal Processing (RTP) systems wafers can be annealed. As components of testing machines, the radiation furnaces are very small and it is especially used for thermo mechanic fatigue (TMF) tests.

Metal organic chemical vapor deposition (MOCVD)

Facilities and methods enabling nanolayer and single atom layer deposition, nanostructure preparation and fabrication of new devices and systems (electronic, photonic, electromechanical).

Plasma Enhanced CVD of Si-based materials Oxford Instruments Plasma Technology PlasmaPro 100 (PECVD)

Plasma enchanced chemical vapour deposition using chemically reactive plasma for deposition of silicon based materials.

RIE by Fluorine Chemistry and PECVD of hard C-based films Oxford PlasmaPro NGP 80  (RIE-FLUORINE)

Thin film deposition by plasma enchanced chamical vapour deposition. Etching of silicon and metals by reactive ion etching.

RIE by Chlorine Chemistry Oxford Instruments Plasma Technology PlasmaPro 100  (RIE-CHLORINE)

Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers.

Electron beam evaporator BESTEC  (EVAPORATOR)

Thin film deposition by electron beam evaporation.

Atomic layer deposition system Ultratech/CambridgeNanoTech Fiji 200  (ALD)

Atomic Layer Deposition is a deposition technique for very thin layers with the thickness control down to a single atomic layer. It belongs to the CVD techniques family.

Ion-Beam Sputter Deposition System BESTEC  (KAUFMAN)

Suitable for Ion-beam sputter deposition, Ion-beam assisted deposition, reactive sputter deposition with nitrogen and in-situ initial/continual substrate (pre-)cleaning.

 ​ Packaging

Laser dicer Oxford Lasers A-Series (LASERDICER)

These laser micromachining systems are designed as versatile R&D, process development or pilot production systems.

Wire bonder TPT HB 16 (WIREBONDER)

Wire bonding is a micro-welding technique for electrical interconnection of the sample substrate structures and semiconductor chip thin metallic layers. Contact between the sample surface and pure gold, alloyed aluminum or copper wire is provided by three main methods: ultrasonic, thermocompression and thermosonic bonding.


 ​ Floorplan

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