Nanocharacterization laboratory equipment

 ​ Electrical and magnetic measurements 

4-probe station Cascade Microtech MPS 150 (MPS150)

Probe station CASCADE MPS 150 is a modular probe station system which allows various configurations. System is designed for four-point electrical measurement in temperatures up to 300°C in combination with source measurement units. Machine allows wafer level device characterization I-V/C-V, RF, and another electrical testing.

Keithley 4200-SCS Parameter Analyzer (KEITHLEY-4200)

The 4200-SCS is a modular, fully integrated parameter analyzer that performs electrical characterization of materials, semiconductor devices and processes. Consisting of Source Measure Units for IV characterization, Capacitance-Voltage module for AC impedance measurements, and Ultra-fast Pulsed IV that performs waveform capture, and transient IV measurements, the 4200-SCS provides the researcher or engineer with critical parameters needed for materials research, semiconductor device design, development or production.

Mini Cryogen-Free Magnet System - Cryogenic Limited (CRYOGENIC)

The Mini Cryogen-Free Magnet System from Cryogenic Limited company is a physical device used for production of strong magnetic field created by a superconducting coil. The system combines the latest cryogen-free technology with sophisticated measurement techniques.

Semi-automated 4-probe system Cascade Microtech SUMMIT 12000 (SUMMIT)

SUMMIT Semi-automated probe station is precise on-wafer device and process characterization system.

Low temperature 4-probe station LakeShore CRX-EM-HF (LAKESHORE)

Low Temperature Electro-Magnetic Properties Measurement System LAKESHORE CRX-EM-HF is Cryogen-free horizontal field magnet close cycle refrigerator-based cryogenic probe station. It allows contacting samples with micro-manipulators and measuring in cryo temperatures with sample size up to 1 in diameter

  Microscopy and nanomanipulation

Focused Ion Beam/Scanning Electron Microscope TESCAN LYRA3 (LYRA)

SEM/FIB is a type of microscope where a focused electron/ion beam is scanned over the sample to generate an image of the surface or to modify it with nanometric resolution (usually better than 10 nm).


Scanning Probe Microscope designed for easy integration into the Electron Microscopes.
The combination of complementary SPM and SEM techniques enables to use the advantages of both commonly used microscopy techniques.

Scanning Near-field Optical Microscopy MV 4000 (SNOM-NANONICS)

SNOM is a microscopic tool, which breaks the far-field light resolution limit by mapping the near-field light (evanescent waves) distribu- tion of nanostructures. In order to achieve this, there is a very sharp optical probe (detectors/illuminators), which has an aperture of tens of nanometers. 

Scanning Probe Microscope Bruker Dimension Icon (ICON-SPM)

The Dimension Icon’s superior resolution provides the user with a significant improvement in measurement speed and quality.

Hysitron TI 950 (NANOINDENTOR)

The TI 950 combines Hysitron’s patented three plate capacitive transducer* technology with state-of-the-art control technology to achieve unmatched performance in nanomechanical characterization.


High vacuum coater for deposition of conductive coatings on SEM and TEM samples. Processes are driven by bulit-in microprocessor control unit and are fully automatized. Process steps and parameters are set through a touch screen.
Equipped with Au sputter target and carbon thread evaporation source as standard.
Other targets for sputtering available only on request.

Optical microscope Zeiss Axio Imager A2m (ZEISS-A2m)

Microscope Zeiss Axio Imager.A2 for reflected-light, bright field, dark field, polarization microscopy and Kerr microscopy. With PC interface.

 ​ Optical measurements

Scanning Probe Microscope + microRaman + PhotoLuminiscence system NT-MDT Ntegra Spectra + Solar II (TERS)

NTEGRA Spectra is a UV-VIS-NIR combined AFM + Raman spectrometer by NT-MDT equipped also with standard optical microscope with mapping feature for conventional micro Raman spectroscopy. The equipment is capable of full polarisation measurements (for e.g. for luminescence measurement). The equipment is placed on an air floating bedboard in the clean rooms service area.

MIR spectroscopic ellipsometer J. A. Woollam IR-VASE (WOOLAM-MIR)

The spectroscopic ellipsometer covers the spectral range from 1.7 to 30 microns (333 to 5900 wavenumbers).

Vacuum FTIR Vertex80v + microscope Hyperion 3000 (FTIR)

Instrument consists of a combination of Fourier infrared spectrometer with infrared microscope. In the spectrometer, one can perform transmission and reflection experiments on samples dimension of roughly 1 mm² and more

NIR-UV spectroscopic ellipsometer J. A. Woollam V-VASE (WOOLAM-VIS)

The VASE is most accurate and versatile ellipsometer for research on all types of materials: semiconductors, dielectrics, polymers, metals, multi-layers, and more. It combines high accuracy and precision with a wide spectral range from 193 to 2000nm.

Vacuum ultraviolet spectrometer McPherson VUVAS 1000 (VUVAS)
The VUVAS spectrophotometer directly measures reflectance and transmittance properties of materials in vacuum ultraviolet (VUV) range.


 ​ UHV Technologies

Scanning Auger Microscopy with Scienta Omicron nanoSAM Lab (NANOSAM)

The NanoSAM LAB S is a dedicated surface analysis UHV system for high resolution structural and chemical analysis by Scanning Auger Microscopy (SAM), and equipped with detector Spin Polarization Analysis (SEMPA).

Secondary Ion Mass Spectroscopy ION-TOF TOF.SIMS5 (SIMS)

TOF-SIMS is an acronym for the combination of the analytical technique SIMS (Secondary Ion Mass Spectrometry) with Time-of-Flight mass analysis (TOF). The technique provides detailed elemental and molecular information about the surface, thin layers, interfaces of the sample, and gives a full three-dimensional analysis.

X-ray Photoelectron Spectroscopy Kratos Analytical Axis Supra (KRATOS-XPS)
AXIS SupraTM is an X-ray photoelectron spectrometer (XPS) with unrivalled automation and ease of use for materials surface characterisation.
Ultra High Vacuum Preparation and Analytical System (UHV-CLUSTER)

The complex UHV system combines preparation and in-situ analysis by several complementary methods for the characterization of surfaces and thin films.
The individual units are designed to allow the users to work simultaneously. The configuration of the apparatus and the selection of analytical methods allows for studying of the structure of sample surface layers, their chemical composition and electronic structure in real time, at both a micrometre and nanometre scale.

 ​ Floorplan

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