Wire bonder TPT HB 16 (WIRE-BONDER)


Guarantor:
Marek Vaňatka

Instrument status:
Operational Operational, 9.2.2018 17:08

Equipment placement:
CEITEC Nano - C1.57


Wire bonding is a micro-welding technique for electrical interconnection of the sample substrate structures and semiconductor chip thin metallic layers. Contact between the sample surface and pure gold, alloyed aluminum or copper wire is provided by three main methods: ultrasonic, thermocompression and thermosonic bonding. The welding process is realized by wire attached to the substrate by bonding tool at the end of ultrasonic transducer, which is getting closer to certain distance to the sample surface. To achieve enhanced welding capability, sample is heated up to a certain temperature, for most processes being in the range from 20 °C to 250 °C. Attachment techniques defined by bonder tools are performed by wedge-wedge, ball-wedge, ribbon and bump bonding class.


Publications:

Show more publications...

Photogallery

Specification

Wire Bonding methods Ultrasonic
Thermocompression
Thermosonic
Ultrasonic transducer 62 kHz, up zo 2W power
Sample size up to 100 mm x 150 mm
Sample (chip) holder – chuck heated up to 250 °C
Wire material Gold
AlSi1
Wire diameters from 17 um up to 75 um
Wire option ribbon up to 25 um x 250 um
Loop shaping motorized Y and Z axis with 9 intersection points
Software possibility to store up to 100 recipes

Advanced

Ultrasonic power 0 – 2 000 mWatt output
Bond time 0 – 10 s
Bond force 0 – 1 500 mN
Bonding tool diameter 1,58 mm, length 19 mm
Motorized wire spool siamater 50,8 mm
Wire termination bond head tear / clamp tear
Wire feed angel 90 °
Clamp movement motorized, Up / Down
Motor speed (axis Y, Z) 0 – 100 %

Documents

Here is place for your documents.