Large Plasma Enhanced CVD (R2-PECVD)

The deposition chamber allows plasma processing of large substrates in capacitively coupled plasma (CCP). It is primarily used to deposit amine plasma polymers, i.e., organic thin films containing nitrogen functional groups, by plasma enhanced chemical vapor deposition (PECVD). These films are hydrophilic and have a positive surface charge. They can act as bioactive surface modifications helping the cells to attach to the coated surface, improving the cell adhesion or binding the biomolecules. Any material can be coated, even temperature-sensitive substrates like polycaprolactone nanofibrous mats. The plasma reactor can also be used for plasma treatment of materials in Ar or O2 plasma. This treatment will improve the adhesion of subsequently prepared thin films and change the surface-free energy or roughness. Additionally, oxygen plasma can be applied to etch organic materials, e.g., for surface cleaning. The processes are tunable and flexible because the pressure and RF power will vary the extent of ion bombardment and monomer dissociation. Various PECVD processes can be set up and developed upon a reasonable request. The process receipts are supported by the expertise of Assoc. Prof. Lenka Zajíčková, see https://plasma-technologies.cz/