Magnetron sputtering system BESTEC (MAGNETRON)


Guarantor:
Jan Prášek, Ph.D.

Instrument status:
Operational Operational, 2.6.2020 13:52

Equipment placement:
CEITEC Nano - C1.36


The system consists of a sputter deposition chamber with 8 magnetrons in sputter up configuration. The lid flange of the sputtering chamber is sealed with double viton o- rings and differentially pumped.
For the chamber we use turbomolecular pumps with scroll foreline pump. For good end pressure a Ti- sublimation pump is also included. With the pumping configuration it is possible to reach the base pressure of 3x 10-9 mbar with bake out of the clean chamber. The gas inlet in the process chambers is realized with mass flow controllers. For sputter gas Ar we use a 50sccm range device and for O2 and N2 a 10sccm device is used. Pressure regulation is done by up stream process using a three stage valve over the turbo pump. The substrates max. 4” in diameter or several smaller substráte pieces can be mounted on different sample holders from molybdenum (totally 2 in the scope of supply).
There is a manually sample transfer foreseen into and out of the process chamber.
In the process chamber the sample can be heated to 850°C with radiation heating. The sample stage is thermal shielded and water cooled to prevent from heating up. The substrate can rotate motorized with max. 30 rpm.


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Rules for long term reservation

Magnetron can be booked for several days in a row, if necessary up to 4 days in 14 days. During the booked period, you will have a magnetron for yourself and no one else will be able to use it. If you find that your reservation is no longer needed, cancel it in the reservation system and inform other users. The use of the reserved time on the magnetron will be controlled by both guarantors & users.

Specification

3 DC source  power up to 500W
1 RF source  power up to 300W
8 targets W, Au, FeRh, Pt, Co, Ta, Al, Ti
please check the Loggbook for current targets in Magnetron
loadlock YES
sample size  up to 6”
rotation of substrate YES
substrate temperature  RT – 850 °C
gas line for reactive deposition O2 or N2
standard materials Ag, Al, Au, Bi, C, Co, Cr, Cu, Gd, Fe, Hf, Mo, Mn, Nb, Ni, Pt, Ru, Si, Sb, Sc, Ta, Ti, W, Zr, TiN, TiO2, AlCuSi, NiCr, Ni80Fe20, Ir20Mn80, Fe75Co25, Fe50Rh50, Al2O3, SiO2, Co20Fe60B20
Additional cost Au + Pt

​Self-service users have 20 nm of Pt and Au for free - everything above is 15 CZK/nm

Full-service cost is 15 CZK/nm for academic and 20 CZK/nm for commercial projects

Documents

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