Hysitron TI 950 (NANOINDENTER)
Saeed Mirzaei, Ph.D.
Operational, 24.4.2020 11:33
CEITEC Nano - C1.22
The TI 950 combines Hysitron’s patented three plate capacitive transducer* technology with state-of-the-art control technology to achieve unmatched performance in nanomechanical characterization. The system features a sub 30 nN force noise floor, ultra-fast feedback control, user-definable data acquisition rates up to 30 kHz, the widest range of nanomechanical testing techniques, and the ability to test with various Hysitron heads seamlessly. The superior staging system on the TI 950, along with the in-situ Scanning Probe Microscopy (SPM) imaging capability, provides unparalleled precision in test-placement accuracy and data repeatability.
Mouralova K., Benes L., Bednar J., Zahradnicek R., Prokes T., Matousek R., Hrabec P., Fiserova Z., Otoupalik J., 2019: Using a DoE for a comprehensive analysis of the surface quality and cutting speed in WED-machined hadfield steel. JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY 33(5), p. 2371 - 2386, doi: 10.1007/s12206-019-0437-4
(LYRA, TITAN, TEGRAMIN, NANOINDENTER, HELIOS)
Yavas, H.; Fraile, A.; Huminiuc, T.; Sen, H. S.; Frutos, E.; Polcar, T., 2019: Deformation-Controlled Design of Metallic Nanocomposites. ACS APPLIED MATERIALS AND INTERFACES 11(49), p. 46296 - 46302, doi: 10.1021/acsami.9b12235
(NANOINDENTER, TITAN, HELIOS)
Mouralova, K.; Benes, L.; Zahradnicek, R.; Bednar, J.; Hrabec, P.; Prokes, T.; Matousek, R.; Fiala, Z., 2018: Quality of surface and subsurface layers after WEDM aluminum alloy 7475-T7351 including analysis of TEM lamella. THE INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY 99(9-12), p. 2309 - 2326, doi: 10.1007/s00170-018-2626-1
(LYRA, ICON-SPM, HELIOS, TITAN, TEGRAMIN, NANOINDENTER)
Hysitron's TI 950 TriboIndenter Features:
Quasistatic nanoindentation – Measure Young’s modulus, hardness, fracture toughness, and other mechanical properties via nanoindentation.
Scratch testing – Quantify scratch resistance, critical delamination forces, and friction coefficients with simultaneous normal and lateral force and displacement monitoring.
Top-down optics – High- resolution, colour CCD camera for individual structure identification and coarse test positioning.
SPM imaging – In-situ imaging using the indenter tip provides nanometer precision test positioning and surface topography information
Dual head testing capability for true nano/micro-scale connectivity
Active vibration isolation system providing environmental separation
nanoDMA – Investigate time-dependent properties of materials using a dynamic testing technique designed specifically for polymers and biomaterials
Modulus Mapping – Obtain quantitative maps of the storage and loss stiffness and moduli from a single SPM scan 3D OmniProbe – Provides forces up to 10 N and scratch lengths up to 150 mm for depth- sensing micro-indentation and tribological studies
nanoECR – Conductive nanoindentation system capable of providing simultaneous in-situ electrical and mechanical measurements for investigating material deformation and stress-induced transformation behaviour
Thermal control – Heating/cooling stages can be added for the investigation of mechanical properties at non-ambient temperatures
Vacuum stage – Wafer mounting system that eliminates the necessity of glueing or cutting wafers prior to testing
Long probes that allow to safely investigate the mechanical properties of samples immersed in water.