UHV Preparation and Analytical System - Low Energy Electron Microscope SPECS FE-LEEM P90 (UHV-LEEM)

Low energy electron microscope (LEEM) is one of the instruments of the UHV-Cluster, which combines preparation and in-situ analysis by several complementary methods for the characterization of surfaces and thin films. The LEEM instrument utilizes low energy, elastically backscattered electrons to image surfaces with high spatial and temporal resolution. Advantages of LEEM over other surface imaging techniques are real-time imaging capability and existing several unique contrast mechanisms for image formation. LEEM is a powerful tool for studying the dynamic and static properties of surfaces and thin films, phase transitions, reactions, structure and morphology, and more.

Publications:

• ČECHAL, J.; STARÁ, V.; KUROWSKÁ, A.; BLATNIK, M.; PRAVEC, D.; HRUBÁ, D.; KUNC, J.; DRASAR, C.; PLANER, J.; PROCHÁZKA, P., 2026: Structural, electronic, and chemical manifestations of weak molecule-substrate coupling on Bi2Se3 compared with Ag, Au, and graphene. APPLIED SURFACE SCIENCE ADVANCES , doi: 10.1016/j.apsadv.2025.100927; FULL TEXT
  (UHV-LEEM, UHV-PREPARATION, UHV-XPS, UHV-SPM)
• Prochazka, P.; Frezza, F.; Sánchez-Grande, A.; Carrera, M.; Chen, QF.; Stará, V.; Kurowská, A.; Curiel, D.; Jelínek, P.; Cechal, J., 2025: Monitoring On-Surface Chemical Reactions by Low-Energy Electron Microscopy: from Conformation Change to Ring Closure in 2D Molecular Gas. CHEMISTRY 31(20), p. e20250056 - 6, doi: 10.1002/chem.202500561; FULL TEXT
  (UHV-LEEM, UHV-SPM, UHV-DEPOSITION, UHV-PREPARATION)
• PROCHÁZKA, P.; STARÁ, V.; PLANER, J.; SKÁLA, T.; ČECHAL, J., 2025: Structure of epitaxial heteromolecular bilayers probed by low-energy electron microscopy. SURFACES AND INTERFACES 62, p. 106251-1 - 106251-8, doi: 10.1016/j.surfin.2025.106251; FULL TEXT
  (UHV-LEEM, UHV-XPS, UHV-PREPARATION, UHV-SPM)
• JAKUB, Z.; TRLLOVÁ SHAHSAVAR, A.; PLANER, J.; HRŮZA, D.; HERICH, O.; PROCHÁZKA, P.; ČECHAL, J., 2024: . JOURNAL OF THE AMERICAN CHEMICAL SOCIETY 146(5), p. 3471 - 12, doi: 10.1021/jacs.3c13212; FULL TEXT
  (UHV-DEPOSITION, UHV-LEEM, UHV-XPS, UHV-PREPARATION, UHV-SPM)
• KRAJŇÁK, T.; STARÁ, V.; PROCHÁZKA, P.; PLANER, J.; SKÁLA, T.; BLATNIK, M.; ČECHAL, J., 2024: . ACS APPLIED MATERIALS & INTERFACES 16(14), p. 18099 - 13, doi: 10.1021/acsami.3c18697; FULL TEXT
  (UHV-LEEM, UHV-XPS, UHV-PREPARATION, UHV-SPM, UHV-DEPOSITION)

• PROCHÁZKA, P.; ČECHAL, J., 2024: . JOURNAL OF APPLIED CRYSTALLOGRAPHY 57(1), p. 187 - 7, doi: 10.1107/S1600576723010312; FULL TEXT
  (UHV-LEEM, UHV-PREPARATION)
• David, J., 2023: . MASTER'S THESIS , p. 1 - 69; FULL TEXT
  (UHV-DEPOSITION, UHV-PREPARATION, UHV-LEEM, UHV-XPS, UHV-SPM)
• Jeřábek, F., 2023: . BACHELOR'S THESIS , p. 1 - 42; FULL TEXT
  (UHV-DEPOSITION, UHV-PREPARATION, UHV-LEEM, UHV-SPM)
• Makoveev, A. O., 2023: . PH.D. THESIS , p. 1 - 169; FULL TEXT
  (UHV-DEPOSITION, UHV-LEEM, UHV-XPS, UHV-PREPARATION, UHV-SPM)
• PROCHÁZKA, P.; ČECHAL, J., 2023: . ULTRAMICROSCOPY 253, doi: 10.1016/j.ultramic.2023.113799; FULL TEXT
  (UHV-DEPOSITION, UHV-LEEM, UHV-PREPARATION, UHV-SPM)
• Kurowská, A., 2023: . MASTER'S THESIS , p. 1 - 61; FULL TEXT
  (UHV-LEEM, UHV-MBE, UHV-PREPARATION, UHV-SPM, UHV-XPS)
• MAKOVEEV, A.; PROCHÁZKA, P.; BLATNIK, M.; KORMOŠ, L.; SKÁLA, T.; ČECHAL, J., 2022: . JOURNAL OF PHYSICAL CHEMISTRY C (WEB) 126(23), p. 9989 - 9, doi: 10.1021/acs.jpcc.2c02538; FULL TEXT
  (UHV-PREPARATION, UHV-DEPOSITION, UHV-LEEM, UHV-SPM, UHV-XPS)
• JAKUB, Z.; KUROWSKÁ, A.; HERICH, O.; ČERNÁ, L.; KORMOŠ, L.; SHAHSAVAR, A.; PROCHÁZKA, P.; ČECHAL, J., 2022: . NANOSCALE 14(26), p. 9507 - 9, doi: 10.1039/d2nr02017c; FULL TEXT
  (UHV-DEPOSITION, UHV-LEEM, UHV-XPS, UHV-PREPARATION, UHV-SPM)
• MAKOVEEV, A.; PROCHÁZKA, P.; SHAHSAVAR, A.; KORMOŠ, L.; KRAJŇÁK, T.; STARÁ, V.; ČECHAL, J., 2022: . APPLIED SURFACE SCIENCE 600, p. 154106 - 7, doi: 10.1016/j.apsusc.2022.154106; FULL TEXT
  (UHV-DEPOSITION, UHV-LEEM, UHV-XPS, UHV-PREPARATION, UHV-SPM)
• STARÁ, V.; PROCHÁZKA, P.; PLANER, J.; SHAHSAVAR, A.; MAKOVEEV, A.; SKÁLA, T.; BLATNIK, M.; ČECHAL, J., 2022: . PHYSICAL REVIEW APPLIED 18(4), doi: 10.1103/PhysRevApplied.18.044048; FULL TEXT
  (UHV-DEPOSITION, UHV-PREPARATION, UHV-LEEM, UHV-SPM, UHV-XPS)
• PROCHÁZKA, P.; KORMOŠ, L.; SHAHSAVAR, A.; STARÁ, V.; MAKOVEEV, A.; SKÁLA, T.; BLATNIK, M.; ČECHAL, J., 2021: . APPLIED SURFACE SCIENCE 547, p. 149115- - 7, doi: 10.1016/j.apsusc.2021.149115; FULL TEXT
  (UHV-DEPOSITION, UHV-PREPARATION, UHV-SPM, UHV-XPS, UHV-LEEM)
• NAZZARI, D., GENZER, J., RITTER, V., BETHGE, O., BERTAGNOLLI, E., RAMER, G., LENDL, B., WATANABE, K., TANIGUCHI, T., RURALI, R., KOLÍBAL, M., LUGSTEIN, A., 2021: . JOURNAL OF PHYSICAL CHEMISTRY C (WEB) 125(18), p. 9973 - 8, doi: 10.1021/acs.jpcc.0c11033; FULL TEXT
  (UHV-LEEM, UHV-MBE, UHV-DEPOSITION)
• Kormoš, L., 2021: . PH.D. THESIS , p. 1 - 140; FULL TEXT
  (UHV-DEPOSITION, UHV-PREPARATION, UHV-XPS, UHV-LEEM, UHV-SPM, EVAPORATOR)
• KORMOŠ, L.; PROCHÁZKA, P.; MAKOVEEV, A.; ČECHAL, J., 2020: . NATURE COMMUNICATIONS 11(1), p. 1 - 6, doi: 10.1038/s41467-020-15727-6; FULL TEXT
  (UHV-DEPOSITION, UHV-PREPARATION, UHV-LEEM, UHV-SPM, UHV-XPS)
• UHLÍŘ, V.; PRESSACCO, F.; ARREGI URIBEETXEBARRIA, J.; PROCHÁZKA, P.; PRŮŠA, S.; POTOČEK, M.; ŠIKOLA, T.; ČECHAL, J.; BENDOUNAN, A.; SIROTTI, F., 2020: . APPLIED SURFACE SCIENCE 514, p. 145923-1 - 7, doi: 10.1016/j.apsusc.2020.145923; FULL TEXT
  (MAGNETRON, VERSALAB, RIGAKU9, UHV-LEEM, UHV-LEIS, UHV-SPM, UHV-PREPARATION, UHV-XPS, SIMS)
• PROCHÁZKA, P.; GOSALVEZ, M.; KORMOŠ, L.; DE LA TORRE, B.; GALLARDO, A.; ALBERDI-RODRIGUEZ, J.; CHUTORA, T.; MAKOVEEV, A.; SHAHSAVAR, A.; ARNAU, A.; JELÍNEK, P.; ČECHAL, J., 2020: . ACS NANO 14(6), p. 7269 - 11, doi: 10.1021/acsnano.0c02491; FULL TEXT
  (UHV-LEEM, UHV-SPM, UHV-XPS, UHV-PREPARATION, UHV-DEPOSITION)
• FIKÁČEK, J.; PROCHÁZKA, P.; STETSOVYCH, V.; PRŮŠA, S.; VONDRÁČEK, M.; KORMOŠ, L.; SKÁLA, T.; VLAIC, P.; CAHA, O.; CARVA, K.; ČECHAL, J.; SPRINGHOLZ, G.; HONOLKA, J., 2020: . NEW JOURNAL OF PHYSICS 22(7), p. 1 - 12, doi: 10.1088/1367-2630/ab9b59; FULL TEXT
  (UHV-LEEM, UHV-XPS, UHV-LEIS, UHV-DEPOSITION, UHV-PREPARATION)
• Tesař, J., 2020: . MASTER'S THESIS , p. 1 - 67
  (WITEC-RAMAN, MPS150, UHV-LEEM, EVAPORATOR, RAITH, WIRE-BONDER, ICON-SPM)
• REDONDO, J.; LAZAR, P.; PROCHÁZKA, P.; PRŮŠA, S.; MALLADA, B.; CAHLÍK, A.; LACHNITT, J.; BERGER, J.; ŠMÍD, B.; KORMOŠ, L.; JELÍNEK, A.; ČECHAL, J.; ŠVEC, M., 2019: . JOURNAL OF PHYSICAL CHEMISTRY C (PRINT) 123(23), p. 14312 - 7, doi: 10.1021/acs.jpcc.9b00244; FULL TEXT
  (UHV-PREPARATION, UHV-LEEM, UHV-LEIS)
• KORMOŠ, L.; PROCHÁZKA, P.; ŠIKOLA, T.; ČECHAL, J., 2018: . JOURNAL OF PHYSICAL CHEMISTRY C (PRINT) 122(5), p. 2815 - 6, doi: 10.1021/acs.jpcc.7b11436; FULL TEXT
  (UHV-SPM, UHV-LEEM, UHV-PREPARATION)
• REDONDO, J.; TELYCHKO, M.; PROCHÁZKA, P.; KONEČNÝ, M.; BERGER, J.; VONDRÁČEK, M.; ČECHAL, J.; JELÍNEK, P.; ŠVEC, M., 2018: . JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A 36(3), p. 031401-1 - 6, doi: 10.1116/1.5008977; FULL TEXT
  (UHV-LEEM, ICON-SPM)
• Makoveev, A., 2018: . TREATISE TO STATE DOCTORAL EXAM , p. 1 - 32
  (UHV-LEEM, UHV-MBE, UHV-XPS, UHV-PREPARATION, UHV-SPM)