Wire bonder TPT HB 16 (WIRE-BONDER)


Guarantor:
Radim Hrdý, Ph.D.

Instrument status:
Operational Operational, 3.6.2024 10:06, Au wire installation

Equipment placement:
CEITEC Nano - C1.57


Technologies for ensuring the dies to be properly interconnected and packaged with high precision, accuracy and reliability to eliminate damage of dies and enable easily manipulation. Supporting inspection technologies should provide the possibility of optical surface monitoring and inspection of interconnection and soldering process. Electrical characterization probe station is also planned, as well as temperature dependencies and working stress testing of fabricated dies.


Publications:

Show more publications...

Photogallery

Specification

Wire Bonding methods Ultrasonic
Thermocompression
Thermosonic
Ultrasonic transducer 62 kHz, up zo 2W power
Sample size up to 100 mm x 150 mm
Sample (chip) holder – chuck heated up to 250 °C
Wire material Gold
AlSi1
Wire diameters from 17 um up to 75 um
Wire option ribbon up to 25 um x 250 um
Loop shaping motorized Y and Z axis with 9 intersection points
Software possibility to store up to 100 recipes

Advanced

Ultrasonic power 0 – 2 000 mWatt output
Bond time 0 – 10 s
Bond force 0 – 1 500 mN
Bonding tool diameter 1,58 mm, length 19 mm
Motorized wire spool siamater 50,8 mm
Wire termination bond head tear / clamp tear
Wire feed angel 90 °
Clamp movement motorized, Up / Down
Motor speed (axis Y, Z) 0 – 100 %

Documents

Here is place for your documents.