Cross section/broad beam ion polisher Leica EM TIC3X (TIC3X)

Instrument status:
Operational, 19.10.2023 10:57

Equipment placement:
CEITEC Nano - A1.08

Device for ion polishing samples for scanning electron microscopy beam of light ions, enabling the creation of precise cross sections fragile, heterogeneous, porous and temperature sensitive materials for their studies by scanning electron microscopy and analytical methods EBSD, EDS and WDS. Furthermore, the instrument allows ion polishing large surfaces at oblique incidence of the ion beam for studying the foregoing materials mentioned methods.

Publications:

SUCHÝ, J.; KLAKURKOVÁ, L.; MAN, O.; REMEŠOVÁ, M.; HORYNOVÁ, M.; PALOUŠEK, D.; KOUTNÝ, D.; KRIŠTOFOVÁ, P.; VOJTĚCH, D.; ČELKO, L., 2021: Corrosion behaviour of WE43 magnesium alloy printed using selective laser melting in simulation body fluid solution. JOURNAL OF MANUFACTURING PROCESSES 69, p. 556 - 11, doi: 10.1016/j.jmapro.2021.08.006; FULL TEXT
(VERIOS, TIC3X, RIGAKU3)
ŠŤASTNÝ, P.; VACEK, P.; TRUNEC, M., 2020: Characterization of microstructure and phase distribution of sintered multiphasic calcium phosphate bioceramics. CERAMICS INTERNATIONAL 46(4), p. 5500 - 5, doi: 10.1016/j.ceramint.2019.10.300; FULL TEXT
(TIC3X, VERIOS, TITAN, HELIOS, RIGAKU3)

Photogallery

Specification

Ion source

Ion source	Triple ion source, single controllable guns
Ion energy	1 keV to 10 keV
Source current	0.5 to 4.5 mA / 0.1 mA stepsize (per ion source)
Ion current density	10 mA/cm² (per ion source)
Ion beam diameter (FWHM)	0.8 mm (at 10 keV), 2.5 mm (at 2 keV)
Gas	Argon, minimal purity 99.999 % (Ar 5.0)

Sample stages

Cooling stage for cross section polishing
temperature range	from +30 to –150 °C ±5 °C
warm-up temperature	from +1 to +50 °C
sample size	up to 25 × 20 mm x 5 mm (thick)
stage movement	x-direction: ±5 mm; y: ±1 mm; z: 6 mm

Multiple sample stage
number of samples per batch	up to 3 in separate holders
maximum sample size	10 x 10 x 6 mm (thickness 6 mm achievable using different holders 0 - 3 mm and 2,5 - 6 mm)
stage movement	x-direction: 0 mm; y: ±1 mm; z: 4 mm; rotary oscillation: ±5 °

Multiple sample stage

number of samples per batch

up to 3 in separate holders

maximum sample size

10 x 10 x 6 mm

(thickness 6 mm achievable using different holders 0 - 3 mm and 2,5 - 6 mm)

stage movement

x-direction: 0 mm; y: ±1 mm; z: 4 mm; rotary oscillation: ±5 °

Standard stage for cross section polishing
sample size	up to 50 × 50 mm x 5 to 10 mm (thick)
Mask position accuracy	< ±2 μm
Cutting area	Depth > 1 mm, Width > 4 mm
stage movement	x-direction: ±5 mm; y: ±1 mm; z: 6 mm

Rotary stage for planar polishing
max. sample size	Ø 38mm / 12mm thick
max. ion beam polished area	Ø 25mm (for sample diameter of 25mm)
max. lateral movement settings
sample Ø 38mm	± 3mm
sample Ø 35mm	± 5mm
sample Ø 33mm	± 6mm
sample Ø 30mm	± 8mm
sample Ø 28mm	± 9.5mm
sample Ø 25mm	± 11.5mm
sample < Ø 20mm	± 12.5mm
ion beam incident angle settings (1.5° increments)
sample Ø 38mm	0° – 12°
sample Ø 35mm	0° – 13°
sample Ø 33mm	0° – 14°
sample Ø 30mm	0° – 15°
sample Ø 28mm	0° – 16°
sample Ø 25mm	0° – 18°
sample Ø 23mm	0° – 36°
sample < Ø 20mm	0° – 48°
lateral speed setting	0.1 – 2mm/s
rotation speed setting	Low (~2rpm)
	Medium (~6rpm)
	High (~10rpm)
Cross sectioning adaptor for rotary stage
max. sample size	Width = 10 mm; Height = 7 mm; Thickness = 4 mm
max. angle of attack of ion beams	0 ° - 12 °
available stage movements	X, Y, Z = 0 mm NO rotation, only oscillation ± 45 ° maximum