Grinder/polisher Tegramin 30 (TEGRAMIN)


Grinder/polisher Tegramin 30

Guarantor:
Jiří Holas

Instrument status:
Operational Operational, 5.4.2024 11:13

Equipment placement:
CEITEC Nano - A1.04


Semiautomated machine for preparation of materialographic samples by mechanical grinding and polishing. The clamping system accepts samples embedded in 30 mm stubs, produced by Citopress 10 or Citovac machine. The minimum number of samples to be processed is one; the maximum number is 6 samples per run. The machine is equipped with an automatic six-line dosing system for process fluids (wetting agent and polishing suspensions) and one dosing line dedicated to supplying chemically active polishing fluids.


Publications:

Show more publications...

Photogallery

Specification

Disc specifications

Diameter
300 mm
Speed40–600 rpm, variable
Rotational directioncounter-clockwise
Disc motor750 W
Torque
cont. at < 300 rpm23.8 Nm
cont. at 600 rpm11.9 Nm
Max.> 40 Nm


Available pads for grinding and polishing

MD Pianofor plane grinding and fine grinding of materials (HV 150–2000)
MD Mezzofor plane grinding of titanium alloys
MD Moltofor plane grinding of aluminium alloys
SiC foil #180for wet grinding of materials (HV 30–800)
SiC foil #500for wet grinding of materials (HV 30–800)
SiC foil #1200for wet grinding of materials (HV 30–800)
Sic foil #2000for wet grinding of materials (HV 30-400)
SiC foil #4000for wet grinding of materials (HV 30-400)
MD Gekkoadapter for use with SiC Foil or self-adhesive consumables
MD Allegrocomposite disc for one-step fine grinding of materials (>HV 150)
MD Largocomposite disc for one-step fine grinding of ductile materials (>HV 40)
MD Plusfor one-step polishing of sintered carbides and steels
MD Durpolishing cloth for fine grinding and polishing
MD Nap-Tpolishing cloth for final polishing
MD Chempolishing cloth for final polishing


Specimen head specifications

Speed50–150 rpm, variable
Rotational directionclockwise, counter-clockwise
Head motor160 W
Torque10 Nm


Available suspensions

DP-Suspension P 9 μmdiamond suspension for materialographic grinding and polishing
DP-Suspension P 3 μmdiamond suspension for materialographic grinding and polishing
DP-Suspension P 1 μmdiamond suspension for materialographic grinding and polishing
DP-Suspension P 1/4 μmdiamond suspension for materialographic grinding and polishing
DP-Suspension P 0,1 μmdiamond suspension for materialographic grinding and polishing
OP-S Suspensioncolloidal silica suspension for final polishing
OP-AN Suspensionneutral alumina suspension for final polishing
DP-Lubricant Bluecooling and lubricating liquid for fine grinding and diamond polishing
DP-Lubricant Redlubricating liquid for final diamond polishing of softer materials


Documents

Here is place for your documents.