Robust Dipolar Layers between Organic Semiconductors and Silver for Energy-Level Alignment

ACS APPLIED MATERIALS & INTERFACES

KRAJŇÁK, T.; STARÁ, V.; PROCHÁZKA, P.; PLANER, J.; SKÁLA, T.; BLATNIK, M.; ČECHAL, J., 2024: Robust Dipolar Layers between Organic Semiconductors and Silver for Energy-Level Alignment. ACS APPLIED MATERIALS & INTERFACES 16(14), p. 18099 - 13, doi: 10.1021/acsami.3c18697; FULL TEXT
(UHV-LEEM, UHV-XPS, UHV-PREPARATION, UHV-SPM, UHV-DEPOSITION)

Equipment:

• UHV Preparation and Analytical System - Low Energy Electron Microscope SPECS FE-LEEM P90 (UHV-LEEM)
• UHV Preparation and Analytical system - Photoelectron Spectroscopy SPECS Phoibos 150 (UHV-XPS)
• Ultra High Vacuum Preparation and Analytical System - Preparation Chamber SPECS (UHV-PREPARATION)
• UHV Preparation and Analytical System - Scanning Probe Microscopy SPECS Aarhus 150 SPM (UHV-SPM)
• UHV Preparation and Analytical System - Custom Deposition Chamber SPECS (UHV-DEPOSITION)

Research Groups:

• Molecular Nanostructures at Surfaces
• CF: CEITEC Nano

CEITEC authors:

• Tomáš Krajňák
• Pavel Procházka, Ph.D.
• Jakub Planer
• Prof. Jan Čechal, Ph.D.
• Veronika Stará