Infinite selectivity of wet SiO2 etching in respect to Al

MICROMACHINES

GABLECH, I.; BRODSKÝ, J.; PEKÁREK, J.; NEUŽIL, P., 2020: Infinite selectivity of wet SiO2 etching in respect to Al. MICROMACHINES 11(4), p. 365 - 7, doi: 10.3390/mi11040365; FULL TEXT
(EVAPORATOR, SUSS-MA8, RIE-CHLORINE, DWL, SUSS-RCD8)

Equipment:

• Electron beam evaporator BESTEC (EVAPORATOR)
• Mask Aligner, NanoImprint Lithography SÜSS MicroTec MA8/BA8 Gen3 (SUSS-MA8)
• RIE by Chlorine Chemistry Oxford Instruments Plasma Technology PlasmaPro 100 (RIE-CHLORINE)
• UV Direct Write Laser system Heidelberg Instruments DWL 66-fs (DWL)
• Resist coating and development system SÜSS MicroTec RCD8 (SUSS-RCD8)

Research Groups:

• CF: CEITEC Nano

CEITEC authors:

• Prof. Pavel Neužil
• Imrich Gablech, Ph.D.
• Jan Brodský