Development of HfO2/Al2O3 Stack for On-Chip Capacitor Applications

INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY ISSE

HRDÝ, R.; PRÁŠEK, J.; FILLNER, P.; VANČÍK, S.; SCHNEIDER, M.; HUBÁLEK, J.; SCHMID, U., 2019: Development of HfO2/Al2O3 Stack for On-Chip Capacitor Applications. INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY ISSE , p. 1 - 4, doi: 10.1109/ISSE.2019.8810156; FULL TEXT
(ALD, SUSS-MA8, EVAPORATOR, SUSS-RCD8, DWL, RIE-CHLORINE)

Equipment:

• Atomic layer deposition system Ultratech/CambridgeNanoTech Fiji 200 (ALD)
• Mask Aligner, NanoImprint Lithography SÜSS MicroTec MA8/BA8 Gen3 (SUSS-MA8)
• Electron beam evaporator BESTEC (EVAPORATOR)
• Resist coating and development system SÜSS MicroTec RCD8 (SUSS-RCD8)
• UV Direct Write Laser system Heidelberg Instruments DWL 66-fs (DWL)
• RIE by Chlorine Chemistry Oxford Instruments Plasma Technology PlasmaPro 100 (RIE-CHLORINE)

Research Groups:

• CF: CEITEC Nano

CEITEC authors:

• Radim Hrdý, Ph.D.
• Jan Prášek, Ph.D.
• Prof. Jaromír Hubálek, Ph.D.