Metal organic chemical vapor deposition
Guarantor
Filip Münz
Description
System for deposition of thin layers of metal oxides on a horizontally oriented wafer/sample inside a cylindric steel reactor, with higher growth speed and lower control of layer thickness than a related ALD technique. Metal-organic precursors are delivered through a shower-head placed directly above a rotating heated substrate holder, they decompose in contact with the substrate and organic residuals are extracted from the reactor with high-performance pump system.
Precursors in liquid form are evaporated into the carrier gas flow (N2, Ar) in a bubbler tank or two Controlled Evaporator and Mixer (CEM) lines, up to 3 different precursors plus the process oxygen can be used at the same time.
Photogallery
Specification
substrate temperature range | from room temp. up to 800 °C |
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bubbler temperature control | 10–50 °C |
CEM line heater | up to 70 °C |
pressure control | 0.1–103 kPa |
designed materials | TiO2, Fe2O3, BaTiO3, PbZrTiO3, HfO2 |
nonhomogeneity | < 3% |
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