Comparison of on-chip MIS capacitors based on stacked HfO2/Al2O3 nanolaminates
MATERIALS TODAY COMMUNICATIONS
KARTCI, A.; VANČÍK, S.; PRÁŠEK, J.; HRDÝ, R.; SCHNEIDER, M.; SCHMID, U.; HUBÁLEK, J., 2022: Comparison of on-chip MIS capacitors based on stacked HfO2/Al2O3 nanolaminates. MATERIALS TODAY COMMUNICATIONS 33, p. 1 - 8, doi: 10.1016/j.mtcomm.2022.104664; FULL TEXT
(ALD, EVAPORATOR, SUSS-MA8, SUSS-RCD8, MAGNETRON, TITAN, MPS150, KEITHLEY-4200, SUMMIT, KRATOS-XPS)
Equipment:
- Atomic layer deposition system Ultratech/CambridgeNanoTech Fiji 200 (ALD)
- Electron beam evaporator BESTEC (EVAPORATOR)
- Mask Aligner, NanoImprint Lithography SÜSS MicroTec MA8/BA8 Gen3 (SUSS-MA8)
- Resist coating and development system SÜSS MicroTec RCD8 (SUSS-RCD8)
- Magnetron sputtering system BESTEC (MAGNETRON)
- High-resolution (scanning) Transmission Electron Microscope FEI Titan Themis 60-300 cubed (TITAN)
- 4-probe station Cascade Microtech MPS 150 (MPS150)
- Keithley 4200-SCS Parameter Analyzer (KEITHLEY-4200)
- Semi-automated 4-probe system Cascade Microtech SUMMIT 12000 (SUMMIT)
- X-ray Photoelectron Spectroscopy Axis Supra (KRATOS-XPS)
Research Groups:
CEITEC authors: