CEITEC Nano Research Infrastructure
Brno University of Technology
Purkyňova 123, 612 00 Brno
Czech Republic
+420 54114 9207
nano@ceitec.vutbr.cz
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Automatic dicing saw DAD 3221 (DISCO-DICING-SAW)
Guarantor:
Radovan Klusák
Instrument status:
Operational, 26.6.2023 14:27
A precision machine for cuting semiconductor wafers into individual chips or dice. Wafer sizes up to 6 inches made of Si, SiC, glass up to 1 mm thick.
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