ALD Beneq TFS 200 (ALD-BENEQ)

Beneq TFS 200 is a highly versatile atomic layer deposition (ALD) platform, delivering superior film quality in true ALD mode.
Supports deposition on diverse substrates, including wafers, planar objects, porous materials, and complex 3D structures with high aspect ratio (HAR) features, enabling precise coating in even the most demanding applications.
The Beneq TFS 200 offers direct and remote plasma-enhanced ALD (PEALD) as a standard feature. Utilizing a capacitively-coupled plasma (CCP) source—the industry standard—it facilitates a smooth transition from R&D to production environments. The system supports PEALD processes on substrates up to 200 mm.