Target surfacing system Leica TXP (LEICA-TXP)

The instrument is designed to pre-prepare samples for electron as well as light microscopy techniques before they are treated by the ion polishing system Leica TIC3X. Excess material is removed by mechanical milling, grinding, cutting, or polishing without the need to repeatedly attach the sample onto a different carrier. The sample can be positioned in four axes. It is possible to work directly with pin-stub mounted samples SEM.
The instrument is also capable of manufacturing TEM thin foils of 3 and 2,3 mm diameter.