These laser micromachining systems are designed as versatile R&D, process development or pilot production systems. The class 1 enclosure deals with all laser safety issues and the vibration isolated platform helps to maintain the quality of the parts. An on-axis vision system allows inspection of the process and the parts and features manufactured.
|Laser||Diode-pumped solid state Nd:YAG|
|Output||10W @ 40 kHz|
|Pulse Frequency||1 – 200 kHz|
|Lateral range||200 mm x 200 mm|
|Vertical range (maximum sample height)||56 mm|
This machine is equipped with:
Your design for cutting should be in DXF format or DWG (saved by AutoCad 2010). We are able to cut through most of solid materials with thickness up to 1 mm.
Silicon wafers can be grooved and then broken manually.
We have hands-on experiences with these materials:
Note: Please keep in mind that time of cutting through can be counted in days for thick materials (for example 1 mm molybdenum sheet).