Analysis of the effect of material thickness during the WEDM processon cutting speed, topography and morphology

Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture

Mouralova, K.; Benes, L.; Prokes, T.; Bednar, J.; Zahradnicek, R.; Fries, J., 2022: Analysis of the effect of material thickness during the WEDM processon cutting speed, topography and morphology. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS, PART B: JOURNAL OF ENGINEERING MANUFACTURE , doi: 10.1177/09544054221136516; FULL TEXT
(TEGRAMIN, DEKTAK, LYRA)

Equipment:

• Grinder/polisher Tegramin 30 (TEGRAMIN)
• Mechanical profilometer Bruker Dektak XT (DEKTAK)
• Focused Ion Beam/Scanning Electron Microscope TESCAN LYRA3 (LYRA)

Research Groups:

• CF: CEITEC Nano

CEITEC authors:

• Radim Zahradníček, Ph.D.