Demolded hollow high aspect-ratio parylene-C micropillars for real-time mechanosensing applications

APPLIED MATERIALS TODAY

CHMELÍKOVÁ, L.; FECKO, P.; CHMELÍK, J.; SKÁCEL, J.; OTÁHAL, A.; FOHLEROVÁ, Z., 2023: Demolded hollow high aspect-ratio parylene-C micropillars for real-time mechanosensing applications. APPLIED MATERIALS TODAY , p. 1 - 12, doi: 10.1016/j.apmt.2023.101736; FULL TEXT
(DRIE, PARYLENE, SUSS-MA8, XEF2)

Equipment:

• Deep reactive ion etching of Si-based materials Oxford Instruments Plasma Technology PlasmaPro 100 (DRIE)
• SCS Parylene Deposition System (PARYLENE)
• Mask Aligner, NanoImprint Lithography SÜSS MicroTec MA8/BA8 Gen3 (SUSS-MA8)
• XeF2 Etching of Silicon (XEF2)

Research Groups:

• Advanced Biomaterials
• CF: CEITEC Nano

CEITEC authors:

• Peter Fecko
• Zdenka Fohlerová, Ph.D.