Covap Physical Vapor Deposition Platform (MINIEVAP)

Physical vapor deposition (PVD) system for the thermal evaporation of metals and other inorganic materials. The system has four independently-controlled thermal sources with two independent power supplies. The power supplies provide sufficient power for the conventional thermal evaporation of metals, including high-evaporation temperature metals such as titanium. Mini evaporator enables co-evaporation from two of the sources simultaneously. Two deposition rate monitors are integrated into the system to control the co-evaporation. A physical barrier is placed between the two sources and their respective QCMs to prevent cross-talk and allow accurate evaporation rate readings from each source.
The substrate holder is designed for samples up to 10x10 cm and provides manually controlled substrate rotation. The evaporation process is controllable by rate monitor for two QCMs. The opening/closing of shutters and substrate heating can be controlled manually or via a computer controller. The co-deposition or multilayer deposition can be automatically controlled by the user processes as well.