CEITEC Nano Research Infrastructure
Brno University of Technology
Purkyňova 123, 612 00 Brno
Czech Republic
+420 54114 9207
nano@ceitec.vutbr.cz
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Semiautomatic dicing saw ESEC 8003 (DICING-SAW)
Guarantor:
Radovan Klusák
Instrument status:
Operational, 26.6.2023 14:27
A precision machine for cuting semiconductor wafers into individual chips or dice. Wafer sizes up to 6 inches made of Si, SiC, glass up to 1 mm thick.
Photogallery
Specification
| Wafer diameter |
25.4 mm – 152.4 mm
(1" – 6") |
|---|---|
| Wafer thickness | 0.01–5.0 mm |
| Min. cut-width | 50 μm for Si wafer |
| Min. size of chip | 1x1 mm |
| X-axis (feed) | 240 mm |
| Y-axis (index) | 165 mm |
| Index step | 0.02–100 mm |
| Z-axis (verticle) | 10 mm |
| Rotation angle | 0.01–165 degrees |
| Spindle speed | 15,000–50,000 rpm |
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