Semiautomatic dicing saw ESEC 8003 (DICING-SAW)


Semiautomatic dicing saw ESEC 8003

Guarantor:
Radovan Klusák

Instrument status:
Operational Operational, 15.7.2019 11:10


A precision machine for cuting semiconductor wafers into individual chips or dice.

Photogallery

Specification

Wafer diameter 25.4 mm – 152.4 mm
(1" – 6")
Wafer thickness 0.01–5.0 mm
Min. cut-width 50 μm for Si wafer
Min. size of chip 1x1 mm
X-axis (feed) 240 mm
Y-axis (index) 165 mm
Index step 0.02–100 mm
Z-axis (verticle) 10 mm
Rotation angle 0.01–165 degrees
Spindle speed 15,000–50,000 rpm


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