Lithographic wetbench (SUSS-WETBENCH)


Lithographic wetbench

Guarantor:
Erik Pálesch, Ph.D.

Instrument status:
Operational Operational, 6.4.2020 15:25, VP8 door-closed-sensor is bypassed - possible to use

Equipment placement:
CEITEC Nano - C1.30


The RCD8 coat and develop platform can be custom tailored anywhere from e.g. a basic manual spin coater to a GYRSET® enhanced coater and puddle & spray developer tool. It can handle small pieces as well as standard wafers up to 200 mm and serves therefore ideally for daily R&D work up to small scale production.

Photogallery

Specification

LabSpin 6

sample size: from 1 × 1 cm to 4"

rotational speed: up to 6000 RPM

compatible chemicals (guaranteed): PGMEA, PGME, cyklopentanone, 4-butyrolaktone, 1-methyl-2-pyrollidone, IPA, acetone

max. amount of recipes: 200

max. number of steps in one recipe: 40

step time: 0–999 s

edge bead removal option


HP8

sample size: up to 6" square substrate or 8" wafer

max. amount of recipes: 200

max. number of steps in one recipe: 40

step time: 0–999 s, with 1 s increase

temperature range: 30–250 °C

temperature increase: programmable from 1 °C/min to 10 °C/min

nitrogen purge option, setting of distance from hot plate (more than 0,1 µm) option


VP8

sample size: up to 8" round wafer or 6" square substrate

temperature range: 60–200 °C

vacuum via Venturi nozzle

gas senzor for HMDS and exhaust monitor

Documents

Here is place for your documents.