The Hysitron TI 950 TriboIndenter is a nanomechanical test instrument with a high degree of sensitivity and excellent performance. Its Advanced Control Module improves the precision of feedback-controlled nanomechanical testing, provides dual head testing capability for nano/micro scale connectivity, and offers very good noise floor performance. Several different nanomechanical testing techniques are currently possible, making the TI 950 nano-indenter system an effective nanomechanical characterization tool for a wide range of applications.
Quasistatic nanoindentation – Measure Young’s modulus, hardness, fracture toughness and other mechanical properties via nanoindentation .
Scratch testing – Quantify scratch resistance, critical delamination forces, and friction coefficients with simultaneous normal and lateral force and displacement monitoring.
Top-down optics – High- resolution, color CCD camera for individual structure identification and coarse test positioning.
SPM imaging – In-situ imaging using the indenter tip provides nanometer precision test positioning and surface topography information
Dual head testing capability for true nano/micro scale connectivity
Active vibration isolation systemproviding environmental separation
nanoDMA – Investigate time-dependent properties of materials using a dynamic testing technique designed specifically for polymers and biomaterials
Modulus Mapping – Obtain quantitative maps of the storage and loss stiffness and moduli from a single SPM scan 3D OmniProbe – Provides forces up to 10 N and scratch lengths up to 150 mm for depth- sensing micro-indentation and tribological studies
nanoECR – Conductive nanoindentation system capable of providing simultaneaous in-situ electrical and mechanical measurements for investigating material deformation and stress induced transformation behavior
Thermal control – Heating/cooling stages can be added for the investigation of mechanical properties at non-ambient temperatures
Vacuum stage – Wafer mounting system that eliminates necessity of gluing or cutting wafers prior to testing
Long probes that allow to safely investigate the mechanical properties of samples imersed in water.