Hysitron TI 950


Veronika Králová


The Hysitron TI 950 TriboIndenter is a nanomechanical test instrument with a high degree of sensitivity and excellent performance. Its Advanced Control Module improves the precision of feedback-controlled nanomechanical testing, provides dual head testing capability for nano/micro scale connectivity, and offers very good noise floor performance. Several different nanomechanical testing techniques are currently possible, making the TI 950 nano-indenter system an effective nanomechanical characterization tool for a wide range of applications.




Hysitron's TI 950 TriboIndenter Features:

Quasistatic nanoindentation – Measure Young’s modulus, hardness, fracture toughness and other mechanical properties via nanoindentation .
Scratch testing – Quantify scratch resistance, critical delamination forces, and friction coefficients with simultaneous normal and lateral force and displacement monitoring.
Top-down optics – High- resolution, color CCD camera for individual structure identification and coarse test positioning.
SPM imaging – In-situ imaging using the indenter tip provides nanometer precision test positioning and surface topography information
Dual head testing capability for true nano/micro scale connectivity
Active vibration isolation systemproviding environmental separation

Available modules:

nanoDMA – Investigate time-dependent properties of materials using a dynamic testing technique designed specifically for polymers and biomaterials
Modulus Mapping – Obtain quantitative maps of the storage and loss stiffness and moduli from a single SPM scan 3D OmniProbe – Provides forces up to 10 N and scratch lengths up to 150 mm for depth- sensing micro-indentation and tribological studies
nanoECR – Conductive nanoindentation system capable of providing simultaneaous in-situ electrical and mechanical measurements for investigating material deformation and stress induced transformation behavior
Thermal control – Heating/cooling stages can be added for the investigation of mechanical properties at non-ambient temperatures
Vacuum stage – Wafer mounting system that eliminates necessity of gluing or cutting wafers prior to testing
Long probes that allow to safely investigate the mechanical properties of samples imersed in water.




Measurement Planning

Prior measurement – Quasi Static NanoIndentation