High vacuum coater for deposition of conductive coatings on SEM and TEM samples. Processes are driven by bulit-in microprocessor control unit and are fully automatized. Process steps and parameters are set through a touch screen.
Equipped with Au sputter target and carbon thread evaporation source as standard.
Other targets for sputtering available on request.
|Process vacuum||5x10−5 mbar @ 15 min|
|Ultimate vacuum||2x10−6 mbar @ 24 hour|
|Working distance||min. 30 mm, max. 100 mm (z movement motorized)|
|Specimen table||diameter 104 mm|
|Stage tilt||+/- 60° (motorized)|
|Coating time||1–1800 s (without respect to sample damage)|
|Coating thickness||1–1000 nm|
|Coating thickness detection||oscillating quartz crystal, readout resolution: one decimal (0.1 nm accuracy)|
|Process gas for sputtering||Argon 99,99 % or better|
|Venting gas||Nitrogen 99,99 %|
Available materials for deposition
|Material||Deposition method||Deposition source|
|Carbon (C)||evaporation||carbon thread|
|Platinum-Palladium (Pt-Pd: 80/20)||sputtering||target|
|Gold-Palladium (Au-Pd: 80/20)||sputtering||target|
Application Note 1 - Deposition of layers of defined thickness using thickness monitor
Application Note 2 - Incorrect layer thickness